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Press ReleasesHealth Care3D-Circuits Technology: An Innovative Approach to Compact and Efficient Electronic Design

3D-Circuits Technology: An Innovative Approach to Compact and Efficient Electronic Design

BIEL, Switzerland and BERN, Switzerland, July 11, 2025 /PRNewswire/ — As product requirements evolve, engineers and designers search for solutions that enable greater integration, miniaturization, and reliability without compromising on quality or design flexibility. 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology offers a practical solution to these challenges by integrating electronic circuits onto the surfaces of molded parts.

What is 3D-MID?

3D-MID, also known as 3D-Circuits, allows the integration of electrical circuits onto three-dimensional surfaces, eliminating the need for separate circuit boards. This approach supports the development of compact, lightweight, and highly functional products. By enabling circuitry to follow the contours of a molded part, 3D-MID opens new possibilities for design and integration.

Key Benefits of 3D-Circuits

  • Miniaturization: Combine multiple functions such as sensors, LEDs, and connectors into a single component, reducing overall size and weight.
  • Design Flexibility: Adapt circuits to complex shapes and geometries, supporting innovative product designs.
  • Streamlined Manufacturing: Reduce assembly steps which can lead to reduced production time and cost.

Application Examples

  • Medical Devices: 3D-Circuits enables the integration of sensors and circuits into compact medical devices, such as hearing aids and drug delivery implants, supporting improved usability and patient comfort.
  • Consumer Electronics: In smartphones and wearables, 3D-MID supports the integration of more features into smaller spaces, contributing to lighter and more efficient devices.
  • Other Industries: The flexibility and efficiency of 3D-MID make it suitable for a wide range of applications, from automotive components to industrial automation and beyond.

Quality, Security, and Support

HARTING’s 3D-MID solutions are manufactured using certified processes and high-quality materials. We prioritize the protection of intellectual property throughout the development process, offering robust security measures and clear communication at every stage. Our all-in-one approach means you have a single point of contact from concept to production.

Learn More

If you are interested in exploring how 3D-MID technology could benefit your next project, visit www.3D-Circuits.com for detailed resources, whitepapers, and webinars. Our team is available to discuss your specific requirements and provide guidance on integrating 3D-MID into your designs.

Media Contact:

Michael Deckert

+41763242186

397857@email4pr.com

Cision View original content to download multimedia:https://www.prnewswire.com/news-releases/3d-circuits-technology-an-innovative-approach-to-compact-and-efficient-electronic-design-302502386.html

SOURCE HARTING AG – 3D-Circuits

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