Tag: VGG794831062

Proposed Strategic Business Public Company at $575 Million Initial Enterprise Value with Significant Long Term Growth Potential Through Strategic Acquisitions

First QSOC Launch Scheduled with SpaceX in Q4 2026 to Begin Deployment of a Global Orbital Infrastructure Combining Edge Computing, Artificial Intelligence, Post-Quantum Cryptography (PQC) and Secure Satellite Communications

Geneva, Switzerland, June 03, 2026 (GLOBE NEWSWIRE) --

SEALSQ Corp (NASDAQ: LAES), ("SEALSQ" or "Company"), a leader in post-quantum semiconductor technologies and hardware-anchored security solutions, today announced its participation as a lead investor in Quobly’s €130 million Series A financing. The round is led by ST Microelectronics, SEALSQ, Isalt, and the French Public Investment Bank (BPI France).

Geneva, Switzerland, June 02, 2026 (GLOBE NEWSWIRE) --

Following an initial 28% equity stake acquired one year ago, SEALSQ increases its ownership in Wecan Group to a majority position, strengthening its ability to deliver secure, AI-powered compliance solutions and post-quantum financial infrastructure for the global financial industry

Geneva, Switzerland, July 22, 2025 (GLOBE NEWSWIRE) -- SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, today announced a bold strategic move to strengthen its position in the blockchain and post-quantum space. The company is establishing a cryptocurrency investment fund with a commitment of up to $30 million to invest in digital assets as part of its cryptocurrency treasury strategy.
This strategic allocation will directly support SEALSQ’s ongoing post-quantum cryptography initiatives, reinforcing its mission of enabling secure, decentralized infrastructures that are resilient to emerging quantum threats.

Geneva, Switzerland, June 23, 2025 (GLOBE NEWSWIRE) --

Courtesy of SpaceX

Geneva, Switzerland, June 23, 2025 (GLOBE NEWSWIRE) --

By addressing IR Drop at sub-7nm nodes, the solution can significantly boost wafer yields, potentially saving manufacturers millions in production costs; improving yield from 50% to 80% on a single wafer could cut per-chip costs by nearly half.