Tag: Egis Technology; InPsytech

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that...

- A word from our sponsors -

Newsletter Signup

Name(Required)

First Last

Email(Required)

Enter Email Confirm Email

CAPTCHA

Privacy(Required)

I agree with the storage and handling of my data by this website. - Privacy Policy *

Comments

This field is for validation purposes and should be left unchanged.

HomeTagsEgis Technology; InPsytech

SNU Sponsors Usyk vs Dubois II at Wembley

Electrifying and Proven: ExploMar’s WAVE300 Makes Waves at Monaco Energy Boat Challenge

Beijing Review: Chinese and U.S. youth explore the charm of Beijing’s history and modernity

Tag: Egis Technology; InPsytech

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

Newsletter Signup

Explore

Press Releases

News & Opinion

Living

Others

Follow us